Challenges in Flip Chip Die Sorting, Handling and Inspection

ABSTRACT The growing number of bare die applications naturally require faster and more efficient die sorting systems; however, at the same time, the quality requirements have become increasingly stringent, with more and more end users calling for zero defects! The capabilities of such systems have to combine speed (in excess of 10k UPH) and extreme vision inspection capabilities. These capabilities are challenged by the constantly growing variety of wafer materials and types, subsequent lighting influences, inspection criteria and various packaging media.