Preparation of Dicyclopentadiene Resin-sealed Power Modules and Comparative Power Cycle Tests under High Temperature and High Humidity Conditions

Epoxy resin and silicone gel are commonly utilized as encapsulation materials in power modules due to their processability and electrical insulation properties. However, both materials reliability present challenges under demanding operating conditions. Epoxy resins are prone to void formation during molding, and their high rigidity can induce cracking or mechanical damage to semiconductor chips and bonding wires under thermal cycling stress. Silicone gels, while more compliant, are susceptible to partial discharge phenomena such as electrical treeing and void generation when subjected to prolonged high electric field exposure [1] .