Tool-Agnostic Pulse Reverse Electroplating for High Aspect Ratio Through Glass Vias in Advanced Packaging

High aspect ratio (HAR) through glass vias (TGVs) are critical enablers for advanced electronic packaging, offering vertical interconnects with excellent dimensional stability. This study presents a tool-independent pulse reverse electroplating (PRE) process for copper filling of TGVs, developed and validated using a generic 20-liter plating setup. The process was optimized across multiple via geometries (400 × 70 µm, 590 × 90 µm, and 800 × 100 µm), achieving inclusion-free results and significantly reduced plating times. While the influence of cuprous ions and additive dynamics is acknowledged, the focus remains on practical outcomes. Ongoing work includes electrochemical and simulation-based studies to further understand the process mechanisms and explore the potential of geometry- and agitation-optimized plating tools for next-generation packaging demands.