Validation of sub wavelength holographic lithography in a semiconductor related approach within the EU funded Project HoliSTEP

HoliSTEP aims to validate an industrial prototype of sub-wavelength lithography stepper tool operating at 345 nm with 200 nm resolution, 25 nm alignment accuracy in an operational environment, demonstrating high-resolution 2D and 3D semiconductor and micro component devices manufacturing with optimized costs, broader production capabilities and reduced material wastage.