Finite Element Thermal Analysis of the Effects of Cabling and Connectors on Heat Dissipation in SMD-Based PCBs

This work aims to evaluate the influence of cabling and connector volume on the thermal performance of a fancooled SMD printed circuit board (PCB) for a 1000 W single-phase power inverter. An ANSYS Icepak three-dimensional model of the PCB is developed, including power semiconductors, external cabling, and the active heat dissipation system. The analysis focuses on the effect of cabling and connectors located along the forced air cooling path on the thermal performance of the MOSFETs. To validate the proposed methodology, experimental prototypes were developed with two different types of connection, featuring similar layouts in terms of dimensions, component placement, and thermal distribution areas.