Rice Husk Fiber-Based Polishing Pad for Chemical Mechanical Polishing (CMP) of Sapphire

This research aims to study the properties of polishing pads made from polyurethane mixed with rice husk fiber for use in chemical mechanical polishing (CMP) of sapphire. After cleaning and sizing, the rice husk fiber was modified using hydrochloric acid (HCl). Then, both unmodified and modified rice husk fibers were mixed with polyurethane at ratios of 7.5, 10, and 12.5 phr to form polishing pads. The hardness and polishing performance of these pads in sapphire CMP were then tested. The experimental results showed that polishing pads from rice husk fiber could be successfully formed and remained stable. The natural fibers were evenly distributed across the contact surface of the pads. The hardness of polishing pads from rice husk fiber was smaller than conventional polishing pad (SUBA800) in range of 40.5–47.5%. Polishing results revealed that pads made from polyurethane mixed with unmodified and modified rice husk fiber achieved the highest material removal rates (MRR) of 94.2% and 64.7%, respectively, compared to the conventional pad. These results indicate that both types of fibers able to be used as a material for manufacturing polishing pads for adding value and reducing the waste from the agricultural.