Advanced High-Density Substrates and Circuits Leveraging Liquid Crystal Polymer and Ultra-Low Loss Dielectrics for High-Speed Digital and RFMW applications

Precision Circuit Technologies will present a set of unique additive and semi-additive circuit fabrication processes leveraging the high-speed properties of Liquid Crystal Polymer and specialty Ultra-Low_Loss dielectric materials combined with unique metallization techniques. Application examples of high layer count substrates up to 30 layers, high-speed flexible circuits and rigid-flex will be compared to other material sets such as ABF and glass core substrates. Unique fabrication capabilities at 25 micron, 12 micron, and 6 micron line and space nodes will be demonstrated with a focus on thermal, power and electrical performance enhancements such as embedded coaxial and twin axial signal lines, multiple metal thickness traces per layer, and electro-deposited copper internal heat sinks. In addition, PCT will detail a 3D printing process and platform that enhances traditional circuit fabrication process steps and provides a rapid method to develop very high-performance, high-density circuits that approach production-level performance leveraging Liquid Crystal Polymer, Ultra Low Loss dielectric and particle-free ink metallization.