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Designing stronger Cu–W interfaces: The role of Ta, Ti, and Zr doping | Researchclopedia

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Designing stronger Cu–W interfaces: The role of Ta, Ti, and Zr doping

20260 citationsJournal Article

Authors

Debamoy Pegu · Institute of Advanced Study in Science and Technology

Dhrubanka Sarma · Institute of Advanced Study in Science and Technology

Ujjal Saikia · NXP (Germany)

Munima B. Sahariah · Institute of Advanced Study in Science and Technology

Topics & Keywords

Fusion materials and technologies Copper Interconnects and Reliability Microstructure and mechanical properties

Publication Details

Published in: Journal of Physics and Chemistry of Solids

Volume 213, pp. 113608-113608

DOI: 10.1016/j.jpcs.2026.113608

Field-Weighted Citation Impact: 0.00