Scanning-Based Dynamic Mask Projection for Ultrafast Laser Ablation of Thin Films

Ultrafast laser processing is constrained by an inherent throughput-resolution trade-off, typically addressed either by high-speed single-beam scanning or by parallel processing approaches. Here, a scanning-based dynamic mask projection concept is presented, combining both strategies by integrating a digital micromirror device (DMD) for dynamic binary amplitude mask generation with galvanometric scanning for high-speed lateral repositioning of the projected pattern. A high-numerical-aperture microscope objective is used to project the mask for thin film laser ablation with sub-micrometer feature sizes, while scanning extends the processing area beyond a single projected pattern, ultimately limited by the objective's field of view. The concept is demonstrated by selective single-pulse pattern ablation of 10 nm thick tantalum nitride (TaN) thin films on glass substrates using 230 fs pulses at a center wavelength of 515 nm. The optical system enables a 770 nm minimum feature size across a scan field with an area-equivalent circular diameter of 550 µm. Dynamic mask projection combined with fast scanning offers a scalable route to high-throughput laser nanoprocessing and is relevant to fabrication and processing of nanomaterials, digital mask lithography, and micro- and nanomachining.