Isolator-free integration of a temperature-tuned III-V distributed feedback laser in a silicon photonic package using photonic wire bonding

We present a fully assembled, low-cost, hybrid-integrated distributed feedback (DFB) III-V laser bonded in an on-chip trench of a silicon photonic integrated circuit (PIC). The laser is coupled to the PIC via photonic wire bonds (PWBs), which provide a low-reflection interface to the PIC, enabling robust, isolator-free single-mode operation over a wide temperature range (up to 70°C, verified by thermal imaging). Through thermal tuning, we achieved continuous single-mode tuning of the operating wavelength up to 4.3 nm (determined to be a tuning efficiency of ∼0.1 nm/°C). We pave the way for densely integrated hybrid DFB-PIC laser packages.