Additive Manufacturing for Electronics (AME): Prototyping High Surface Area Substrates to Improve Thermal Performance

Nowadays, Additive Manufacturing for Electronics (AME) is gaining ground in device fabrication for the numerous advantages of these types of manufacturing technologies, such as fast production processes, freeform design, and low-cost prototyping. In this scenario, the proposed research work is focused on evaluating an innovative strategy for a common issue in power electronics, which is related to the generation of hotspots. To face this problem, the 3D printing of ceramic substrates with different high surface areas was studied to improve thermal dissipation. Together with improved thermal management, the upper surface of the devices enabled the deposition of a desired conductive pattern and the bonding of bare die components for device fabrication. Finally, thermal exchange was monitored to verify the efficacy and efficiency of the devices’ dissipation capabilities. The proposed models exhibited a 70% temperature reduction upon transitioning from air to water. Furthermore, the operating temperature remained stable for 10 min, meeting the specific requirements of the intended application.