7.1 54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation

We report a <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$54 \times 42$</tex>-resolution SPAD-based LIDAR receiver SoC leveraging 3D-stacked <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$65 / 40 ~\text{nm}$</tex> technology with high-frequency TDC and 2 counters for ToF and intensity exposure, with peripheral memories used for image signal processing (ISP) frame stores, point cloud generation & HDR management. A hybrid on-chip & package-embedded 25V boost converter is described integrating SPAD supply generation synchronized with sensor frame timing. The sensor is integrated in a LIDAR module for 9.6m ranging with <1cm error.