PIC design optimization for high-speed data center applications

This paper explores a design workflow that combines full-wave electromagnetic (EM) simulations, circuit- and system-level simulations for photonic integrated circuits (PICs) applications in datacenter interconnects. The proposed framework ensures seamless interoperability between different levels of PIC design and model customization. We demonstrate its effectiveness with an example of a custom 1 Tb/s wavelength-division multiplexing (WDM) silicon-photonics-based four-level pulse amplitude modulation (PAM-4) system.