Stereolithography Additive Manufacturing of Conductive SiOC‐Cu Interpenetrating Phase Composite with Improved Ductility, Thermal Stability, and Corrosion Resistance (Adv. Mater. Technol. 5/2026)

Stereolithography Additive Manufacturing In their Research Article (10.1002/admt.202501276), Ming Liu, Chang Quan Lai, and co-workers show how Cu powder mixed with preceramic photoresist is additively manufactured via stereolithography. A subsequent pyrolysis step transforms the part into a 51% SiOC- 49% Cu cermet with tightly interlocked ceramic and metal phases. The cermet is highly ductile, electrically and thermally conductive and can resist nitric acid corrosion and temperatures above the melting point of Cu.