Invited: Addressing Electromigration Challenges in 3D Integrated Circuit (3DIC) Wafer-On-Wafer Technology: EM analysis in 3DIC – status and challenges

In the realm of high-density multi-wafer designs, conducting Electromigration (EM) analyses alongside Electro-thermal co-simulation (ETCosim) has become increasingly essential, primarily due to the proximity of heat sources within these systems. A wafer-on-wafer (WoW) technology (similar to TSV based in [3] but flipped) requires solutions for post-layout simulations, particularly for EM analyses and Electro-thermal co-simulation.