Advances in the Reduction of the Warpage for Flip Chip Packages

Abstract Electronic packaging technologies play a pivotal role in the manufacturing of electronic equipment, providing protection against damage and electromagnetic interference, thermal management, electrical connection, signal transmission, and mechanical support. In electronic packaging technologies, flip chip packaging has gained tremendous attention due to its ability to increase input/output (I/O) counts, provide good thermal dissipation and excellent high frequency performance. At present, flip chip packaging has been widely used in electronic devices in wearable, communication, automotive, medical and other fields. Despite advantages of flip chip packages over other traditional packages, warpage remains a major issue that needs to be addressed as it can lead to package failure problems and affect reliability. This paper comprehensively reviews the factors affecting flip chip package warpage including material properties, geometric structure designs, and manufacture process optimization. It also introduces methods for predicting and measuring the warpage of packages.