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Scalable modeling and analysis of heterogeneous TSV-Bump structures

20260 citationsJournal Article

Authors

Yuqin Wang · Institute of Microelectronics

Yajuan Su · Institute of Microelectronics

Xiaojing Su · Institute of Microelectronics

Pengyu Ren · Institute of Microelectronics

Yujie Jiang · Institute of Microelectronics

Zhanzi Chen · Institute of Microelectronics

Topics & Keywords

3D IC and TSV technologies VLSI and FPGA Design Techniques Interconnection Networks and Systems

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Microelectronics Journal

DOI: 10.1016/j.mejo.2026.107198

Field-Weighted Citation Impact: 0.00

Scalable modeling and analysis of heterogeneous TSV-Bump structures | Researchclopedia

Institute of Microelectronics

Yayi Wei · Institute of Microelectronics