High‐Performance Micro‐LED Display Based on Optimized Laser Bonding and Mass Transfer

ABSTRACT This study describes the development of a high‐performance micro‐LED display module fabricated via optimized laser bonding and mass transfer. Refining the laser energy profile and bonding pressure suppressed chip misalignment and interfacial voids, achieving a positioning accuracy of ≤ ± 2 μm. The 6.2‐in. micro‐LED display module exhibited a peak luminance of 50,000 nits, 121.3% of the NTSC 1931 color gamut, and excellent electrical contact. Furthermore, an 11.3‐in. optical engine for a panoramic head‐up display (PHUD) system was constructed by seamlessly tiling two modules, validating the viability of the technology for high‐performance applications such as automotive PHUD systems.