Fabrication and characterization of Cu/GO composite microcomponents via jet electrodeposition

Abstract This study presents a microfabrication strategy for producing Cu/GO composite microcomponents by integrating jet microelectroforming with soft lithography. The approach addresses common issues in powder metallurgy, such as reinforcement agglomeration and property inhomogeneity, offering a cost-effective route to fabricate Cu/GO composite microcomponents with high geometrical fidelity. The research systematically compares jet electrodeposition with magnetic stirring electrodeposition, evaluating their effects on the dimensional accuracy, microstructure, mechanical properties, and tribological performance of the formed microcomponents. Results indicate that jet microelectroforming significantly improves dimensional precision, with the Cu/GO composite exhibiting a deviation of only 0.18% from the master template. The process also yields a refined matrix with an average grain size of 27.69 nm, a microhardness of 226.08 HV, and improved tribological properties, including a low COF of 0.39 and a wear rate of 1.6×10⁻5 mm³/(N·m). The worn surfaces remain smooth without evident delamination, demonstrating good interfacial stability. This work presents a new approach that integrates soft lithography-fabricated conductive PDMS molds with jet electrodeposition to establish a scalable microfabrication method for high-performance, wear resistant metal matrix composite microcomponents.