High-resolution fabrication process for silicon ion masks

19883 citationsJournal Article

Authors

John N. Randall · Texas Instruments (United States)

Abstract

A process is described for fabricating silicon masks for ion beam lithography. Masks have been fabricated with 0.02-μm features in 1.5-μm-thick silicon membranes.

Topics & Keywords

Advancements in Photolithography Techniques Electron and X-Ray Spectroscopy Techniques Integrated Circuits and Semiconductor Failure Analysis

UN Sustainable Development Goals

Affordable and clean energy

Publication Details

Published in: Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena

Volume 6, Issue 6, pp. 2112-2114

DOI: 10.1116/1.584095

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