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Reliability challenges in 3D IC packaging technology

2010628 citationsJournal Article

Authors

K. N. Tu · University of California, Los Angeles

Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Microelectronics Reliability

Volume 51, Issue 3, pp. 517-523

DOI: 10.1016/j.microrel.2010.09.031

Field-Weighted Citation Impact: 23.29

Reliability challenges in 3D IC packaging technology | Researchclopedia