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K. N. Tu | Researchclopedia

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K. N. Tu

City University of Hong Kong ORCID

205

Works

16,253

Citations

61

h-index

138

i10-index

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Semiconductor materials and interfaces

Affiliations

Heilongjiang University of Science and Technology2024–2024

Semiconductor Manufacturing International (Italy)1967–2012

Langley Research Center1979–1979

IBM (United States)1971–1990

Harvard University1967–1967

Top Works

Thin Films—Interdiffusion and Reactions

J. M. Poate,K. N. Tu,et al.

19791,686 citations

Copper Interconnects and Reliability

Intermetallics and Advanced Alloy Properties

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng,K. N. Tu

20021,348 citations

Recent advances on electromigration in very-large-scale-integration of interconnects

20031,056 citations

Stress evolution due to electromigration in confined metal lines

M. A. Korhonen,P. Bo rgesen,et al.

1993726 citations

Reliability challenges in 3D IC packaging technology

2010628 citations

Interdiffusion and reaction in bimetallic Cu-Sn thin films

1973483 citations

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh,Woon‐Seop Choi,et al.

2002361 citations

Low Schottky barrier of rare-earth silicide on <i>n</i>-Si

K. N. Tu,R. D. Thompson,et al.

1981353 citations

Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions

1994353 citations