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Electromigration resistance of TiWN/Cu/TiWN interconnections

19959 citationsJournal Article

Authors

T. Fukada · Mitsubishi Electric (Japan)

Takeshi Mori · Mitsubishi Electric (Japan)

Yoshihiko Toyoda · Mitsubishi Electric (Japan)

Makiko Hasegawa · Mitsubishi Electric (Japan)

Keisuke Namba · Mitsubishi Electric (Japan)

Kazunao Ogata · Mitsubishi Electric (Japan)

Topics & Keywords

Copper Interconnects and Reliability Metal and Thin Film Mechanics Semiconductor materials and devices

UN Sustainable Development Goals

Affordable and clean energy

Publication Details

Published in: Applied Surface Science

Volume 91, Issue 1-4, pp. 227-233

DOI: 10.1016/0169-4332(95)00123-9

Field-Weighted Citation Impact: 1.10

Electromigration resistance of TiWN/Cu/TiWN interconnections | Researchclopedia