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Reactions of lead-free solders with CuNi metallizations

200065 citationsJournal Article

Authors

Tia‐Marje Korhonen · Cornell University

Peng Su · Cornell University

Sukwon Hong · Cornell University

M. A. Korhonen · Cornell University

C.-Y. Li · Cornell University

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Advanced Welding Techniques Analysis

Publication Details

Published in: Journal of Electronic Materials

Volume 29, Issue 10, pp. 1194-1199

DOI: 10.1007/s11664-000-0012-9

Field-Weighted Citation Impact: 7.31

Reactions of lead-free solders with CuNi metallizations | Researchclopedia