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M. A. Korhonen | Researchclopedia

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M. A. Korhonen

Cornell University

101

Works

2,275

Citations

20

h-index

32

i10-index

Research Topics

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability 3D IC and TSV technologies

Affiliations

University of Helsinki1986–1986

Cornell University1982–2007

Helsinki Institute of Physics1988–1988

Materials Science & Engineering1983–1999

Ithaca College1999–2002

Top Works

Stress evolution due to electromigration in confined metal lines

M. A. Korhonen,P. Bo rgesen,et al.

1993726 citations

Microstructure and mechanical properties

Metal and Thin Film Mechanics

The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue

Donald W. Henderson,James J. Woods,et al.

2004198 citations

Mechanisms of thermal stress relaxation and stress-induced voiding in narrow aluminum-based metallizations

M. A. Korhonen,C. A. Paszkiet,et al.

1991106 citations

Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses

M. A. Korhonen,P. Bo rgesen,et al.

1993102 citations

Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniques

W. R. LaFontaine,C. A. Paszkiet,et al.

199199 citations

Stress relaxation of passivated aluminum line metallizations on silicon substrates

M. A. Korhonen,R. D. Black,et al.

199190 citations

Reactions of lead-free solders with CuNi metallizations

Tia‐Marje Korhonen,Peng Su,et al.

200065 citations

Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between −25°C and 125°C

Tia‐Marje Korhonen,L.P. Lehman,et al.

200762 citations

The effect of current density and stripe length on resistance saturation during electromigration testing

R. G. Filippi,R. Wachnik,et al.

199653 citations