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Rotational grinding of silicon wafers—sub-surface damage inspection

200445 citationsJournal Article

Authors

Antti Haapalinna · Okmetic (Finland)

Saulius Nevas · National metrology institute VTT MIKES

Dietmar Pähler · Fraunhofer Institute for Production Technology IPT

Topics & Keywords

Advanced Surface Polishing Techniques Laser Material Processing Techniques Force Microscopy Techniques and Applications

UN Sustainable Development Goals

Industry, innovation and infrastructure

Publication Details

Published in: Materials Science and Engineering B

Volume 107, Issue 3, pp. 321-331

DOI: 10.1016/j.mseb.2003.12.008

Field-Weighted Citation Impact: 0.00

Rotational grinding of silicon wafers—sub-surface damage inspection | Researchclopedia