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Interdiffusion and reaction in bimetallic Cu-Sn thin films

1973483 citationsJournal Article

Authors

K. N. Tu · Semiconductor Manufacturing International (Italy)

Topics & Keywords

Electronic Packaging and Soldering Technologies Copper Interconnects and Reliability Metallurgical and Alloy Processes

Publication Details

Published in: Acta Metallurgica

Volume 21, Issue 4, pp. 347-354

DOI: 10.1016/0001-6160(73)90190-9

Field-Weighted Citation Impact: 5.19

Interdiffusion and reaction in bimetallic Cu-Sn thin films | Researchclopedia