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Copper interconnection integration and reliability

1995224 citationsJournal Article

Authors

C.‐K. Hu · IBM (United States)

B. M. Luther · IBM (United States)

F. B. Kaufman · IBM (United States)

J.P. Hummel · IBM (United States)

Cyprian Uzoh · IBM (United States)

D.J. Pearson · IBM (United States)

Topics & Keywords

Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies Semiconductor materials and devices

Publication Details

Published in: Thin Solid Films

Volume 262, Issue 1-2, pp. 84-92

DOI: 10.1016/0040-6090(94)05807-5

Field-Weighted Citation Impact: 9.08

Copper interconnection integration and reliability | Researchclopedia