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Cyprian Uzoh | Researchclopedia

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Cyprian Uzoh

Xperi (United States)

51

Works

2,428

Citations

16

h-index

21

i10-index

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

Affiliations

IBM (United States)1987–2002

Division of Materials Research1994–1994

IBM Research - Thomas J. Watson Research Center1988–2002

Xperi (United States)2014–2024

Applied Spectra (United States)2006–2006

Top Works

Damascene copper electroplating for chip interconnections

P. C. Andricacos,Cyprian Uzoh,et al.

19981,216 citations

Advanced Surface Polishing Techniques

Additive Manufacturing and 3D Printing Technologies

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein,J. Heidenreich,et al.

2002350 citations

Copper interconnection integration and reliability

C.‐K. Hu,B. M. Luther,et al.

1995224 citations

A high performance liner for copper damascene interconnects

D. Edelstein,Cyprian Uzoh,et al.

200191 citations

Materials Issues in Copper Interconnections

J. M. E. Harper,E. G. Colgan,et al.

199478 citations

Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates

Joachim N. Burghartz,D. Edelstein,et al.

200263 citations

Die to Wafer Stacking with Low Temperature Hybrid Bonding

Guilian Gao,Thomas Workman,et al.

202039 citations

The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

Laura Mirkarimi,Cyprian Uzoh,et al.

202239 citations

Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

Guilian Gao,Laura Mirkarimi,et al.

201836 citations