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On the root cause of Kirkendall voiding in Cu<sub>3</sub>Sn

2011104 citationsJournal Article

Authors

Liang Yin · Universal Instruments (United States)

Peter Børgesen · Binghamton University

Topics & Keywords

Electronic Packaging and Soldering Technologies Metallurgical and Alloy Processes Advanced materials and composites

UN Sustainable Development Goals

Reduced inequalities

Publication Details

Published in: Journal of materials research/Pratt's guide to venture capital sources

Volume 26, Issue 3, pp. 455-466

DOI: 10.1557/jmr.2010.47

Field-Weighted Citation Impact: 5.93

On the root cause of Kirkendall voiding in Cu<sub>3</sub>Sn | Researchclopedia