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Universal Instruments (United States) | Researchclopedia

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Universal Instruments (United States)

New York, New Yorkcompany

311

Works

5,498

Citations

35

h-index

Top Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Metallurgical and Alloy Processes

Top Researchers

Mervyn Maze University of California, San Francisco

495 works33,095 citationsh-index: 93

Recent Research

BPS2026 – Authentic segmentation-derived references for high-resolution subtomogram averaging

Ivan C Mounteer,Louis A. Perez,et al.

20260 citations

Nanomaterials and Printing Technologies

Aluminum Alloy Microstructure Properties

Advanced Welding Techniques Analysis

Manufacturing Process and Optimization

Copper Interconnects and Reliability

Intermetallics and Advanced Alloy Properties

Integrated Circuits and Semiconductor Failure Analysis

Adhesion, Friction, and Surface Interactions

Metallurgy and Material Forming

Steven L. Shafer Stanford Medicine

432 works18,825 citationsh-index: 63

Heikki Ruskoaho University of Helsinki

412 works15,279 citationsh-index: 63

Norman I. Platnick American Museum of Natural History

392 works11,380 citationsh-index: 47

Ajay Luthra University of Petroleum and Energy Studies

53 works9,673 citationsh-index: 14

Edward M. Phillips Harvard University

147 works6,264 citationsh-index: 41

Thermal Fatigue Behaviors of BGA Packages with an Optimized Solder Joint Layout

Mohammed Abdel Razzaq,Michael Meilunas,et al.

20253 citations

Indium Solder TIM Stability under Temperature Cycling

Piyush Kulkarni,Ali Davoodabadi,et al.

20250 citations

Optimization of Reflow Profile for Solder Thermal Interface Materials with an Inline Vacuum Oven

Piyush Kulkarni,Ali Davoodabadi,et al.

20251 citations

Transdisciplinary Africana Studies and Africana Poetical Science: A Conversation

Ayo Sekai,James B. Stewart

20250 citations

Advancing Semiconductor Packaging: Intelligent Architectures for Heterogeneous Integration Assembly

20250 citations