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Materials Issues in Copper Interconnections

199478 citationsJournal Article

Authors

J. M. E. Harper

L.P. Buchwalter

Topics & Keywords

Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies Semiconductor materials and devices

Publication Details

Published in: MRS Bulletin

Volume 19, Issue 8, pp. 23-29

DOI: 10.1557/s0883769400047709

Field-Weighted Citation Impact: 7.65

Materials Issues in Copper Interconnections | Researchclopedia