From metrology to control: a comprehensive overlay solution for IC manufacturing and packaging challenges

As semiconductor technology evolves and 3D integration rises, overlay metrology must evolve to meet tighter accuracy, precision, and sampling demands. Traditional overlay measurement techniques struggle with high topography and opacity in advanced packaging and SiC materials. This paper introduces a comprehensive solution combining advanced optics, intelligent run-to-run control, and predictive analytics to minimize rework, optimize exposure, and accelerate process development. Real-world case studies demonstrate how integrated metrology and analytics enhance overlay performance and reduce cycle time, enabling faster, first-pass success in high-yield manufacturing.