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With the increasing consumption of ready-to-eat and convenience foods, commercially packaged pickles and sauces have become common components of daily diets across many households. However, concerns regarding their nutritional content, chemical composition, and microbial safety required a detailed evaluation. This research was performed to estimate the quality and safety of selected brands of packaged pickles and sauces available in the market. A total of 10 samples from different well-known and local brands were collected and analyzed for various physicochemical, microbiological and nutritional parameters. The analysis of pickles and sauces samples from different brands revealed varying results across several parameters. The pH was highest in sample T9 (3.56), followed by T8 (3.13), and lowest in T4 (2.81). Acidity peaked in T3 (1.53), with T9 next (1.13), and was lowest in T8 (0.15). Moisture content was highest in samples T1 and T6 (12.39), followed by T3 and T8 (12.04), and lowest in T10 (10.51). Arsenic levels were notably highest in T3 (2.66), followed by T2 (0.48), and lowest in T4 (0.031). Mercury levels were highest in T8 (0.05), moderate in T2, T4, T6, T7, T9, and T10 (0.03), and lowest in T1, T3, and T5 (0.01). Total Plate Count (TPC) was highest in T6 (1.23), followed by T8 (0.62), and lowest in T1, T2, and T10 (0.01). Yeast plate count (YPC) was highest in T10 (2.94), followed by T8 (2.63), and lowest in T2 (0.01). Most samples complied with permissible limits while in some cases, high microbial counts and the presence of spoilage organisms were detected, particularly in products stored under improper conditions. This study highlights the need for stricter quality control, better labeling practices, and increased consumer awareness regarding the safety and quality profile of packaged condiments. The findings provide essential data for regulatory agencies and public health policymakers to ensure safer food products in the market.
Published in: Global Research Journal of Natural Science and Technology
Volume 2, Issue 3