Chemical Resistant Dicing Tape for Hybrid Bonding Process

20250 citationsJournal Article

Authors

Ryoh Takahashi · National Institute of Advanced Industrial Science and Technology

Koki Maruno · Renesas Electronics (United States)

Kazutoshi Furuzono · National Institute of Advanced Industrial Science and Technology

Naoki TAKAHARA · National Institute of Advanced Industrial Science and Technology

Abstract

We report the development of a new dicing tape with excellent chemical resistance and high-temperature adhesion; its resistance to contaminant-removing chemicals makes it promising for enabling a robust hybrid bonding process in modern semiconductor assembly.

Topics & Keywords

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Nanofabrication and Lithography Techniques

Publication Details

DOI: 10.1109/icsj66986.2025.11302709

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Chemical Resistant Dicing Tape for Hybrid Bonding Process

Authors

Abstract

Topics & Keywords

Publication Details