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Resonac (Japan) | Researchclopedia

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Resonac (Japan)

Tokyocompany

91

Works

523

Citations

10

h-index

Top Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Semiconductor materials and devices

Top Researchers

Hiroshi Nakagawa Cleveland Clinic

883 works31,586 citationsh-index: 69

Recent Research

Fatigue life prediction for dissimilar single-lap bonded joints based on relative displacement of adherents

Takahiko SAWADA,Takashi Kawamori,et al.

20250 citations

Advanced Surface Polishing Techniques

Copper Interconnects and Reliability

Plant-Microbe Interactions and Immunity

Silicon Carbide Semiconductor Technologies

Polysaccharides and Plant Cell Walls

Aluminum Alloys Composites Properties

Machine Learning in Materials Science

Nanofabrication and Lithography Techniques

Powder Metallurgy Techniques and Materials

Nobuyuki Takahashi Keio University Hospital

450 works16,147 citationsh-index: 64

Koji Taniguchi Hokkaido University of Science

117 works12,923 citationsh-index: 45

Takashi Masuko Fujita Health University

386 works10,755 citationsh-index: 52

Hiroshi Takahashi Hokkaido University

816 works8,402 citationsh-index: 45

Hideyuki Ogawa Resonac (Japan)

103 works7,638 citationsh-index: 41

Study of Extremely Low Temperature Organic Hybrid Bonding with Grain Engineered Cu

Yoshiki Maruyama,Shigeaki Kessoku,et al.

20250 citations

Foliar application of mixed DAMP- and MAMP-oligosaccharides enhances root growth and fruit yield in okra and tomato in greenhouse experiments

Sreynich Pring,Akira Ashida,et al.

20250 citations

Experiments and Simulation of Heat Storage Materials Using Resin-Coated Regolith

Y. Shimizu,Takayuki Nishino,et al.

20250 citations

Constructing Robust Machine Learning Potential through Enhanced Sampling in UMLIP Latent Feature Space

Akira Matsui,Tsz Wai Ko,et al.

20250 citations

Chemical Resistant Dicing Tape for Hybrid Bonding Process

Ryoh Takahashi,Koki Maruno,et al.

20250 citations