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Ryan Persons | Researchclopedia

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Ryan Persons

13

Works

77

Citations

3

h-index

3

i10-index

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Electrical and Thermal Properties of Materials

Affiliations

Heraeus (Germany)2015–2016

Heraeus (United States)2012–2016

Materials Technology (United Kingdom)2014–2014

Top Works

Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules

Eveliina Juntunen,Aila Sitomaniemi,et al.

201235 citations

GaN-based semiconductor devices and materials

Advanced ceramic materials synthesis

A comparison study for metalized ceramic substrate technologies: For high power module applications

Vincent Wei,Megan Huang,et al.

201415 citations

Thick Printed Copper as Highly Reliable Substrate Technology for Power Electronics

Paul Gundel,Melanie Bawohl,et al.

201514 citations

Highly reliable and cost effective thick film substrates for power LEDs

Paul Gundel,Ryan Persons,et al.

20163 citations

Thermal Performance and Reliability of Copper Thick Film Substrates

Paul Gundel,Torsten Nowak,et al.

20162 citations

Evaluation of a Lead-Free Ultra Low Temperature Co-Fire Ceramic (ULTCC) Tape Designed for Lamination on Aluminum Substrates and a Compatible Co-Fireable Silver Conductor

Steven Grabey,Samson Shahbazi,et al.

20162 citations

Thick Film Materials for High Power Hybrid Circuits on Aluminum Nitride

Matt Sgriccia,Frank Sandoval,et al.

20172 citations

Highly reliable thick film solutions for power LEDs and electronics

Paul Gundel,Melanie Bawohl,et al.

20151 citations

A Low Firing Temperature Copper Conductor for use on an Aluminum Metal Compatible Dielectric in LED Thermal Substrate Applications

Samson Shahbazi,Steve Grabey,et al.

20121 citations