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Electromigration in solder joints and solder lines

200273 citationsJournal Article

Authors

H. Gan · University of California, Los Angeles

Woon‐Seop Choi · University of California, Los Angeles

Ge Xu · University of California, Los Angeles

K. N. Tu · University of California, Los Angeles

Topics & Keywords

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Copper Interconnects and Reliability

Publication Details

Published in: JOM

Volume 54, Issue 6, pp. 34-37

DOI: 10.1007/bf02701847

Field-Weighted Citation Impact: 4.11

Electromigration in solder joints and solder lines | Researchclopedia