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H. Gan | Researchclopedia

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H. Gan

NXP (Netherlands)

21

Works

733

Citations

8

h-index

7

i10-index

Research Topics

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Semiconductor Lasers and Optical Devices

Affiliations

NXP (Netherlands)2025–2025

IBM (United States)2006–2006

University of California, Los Angeles2002–2005

Guizhou University2012–2012

Peking University2010–2012

Top Works

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan,K. N. Tu

2005265 citations

Copper Interconnects and Reliability

Electrical and Thermal Properties of Materials

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

John Knickerbocker,C.S. Patel,et al.

2006182 citations

Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications

S. L. Wright,R. Polastre,et al.

200691 citations

Electromigration in solder joints and solder lines

H. Gan,Woon‐Seop Choi,et al.

200273 citations

Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization

H. Gan,S. L. Wright,et al.

200639 citations

Effect of electromigration on intermetallic compound formation in Pb-free solder-Cu interfaces

H. Gan,K. N. Tu

200330 citations

System-on-Package (SOP) Technology, Characterization and Applications

John Knickerbocker,Paul Andry,et al.

200623 citations

Effect of Electromigration on Mechanical Behavior of Solder Joints

Fei Ren,Jae-Woong Nah,et al.

20058 citations

Formation of nickel disilicide using nickel implantation and rapid thermal annealing

Chel‐Jong Choi,Sung-Young Chang,et al.

20035 citations