Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends

In this study, we investigated and characterized the combined process flow of the UV-USP (ultra-short pulse) laser grooving and plasma dicing wafer singulation technologies and discussed the impact on subsequent hybrid bonding steps. We benchmarked UV-USP laser grooving against UV-nanosecond laser grooving to enable plasma dicing by evaluation of imaging and die strength measurements. The results showed the advantages of the UV-USP laser grooving combined with plasma dicing for the current and future semiconductor production flows.