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Roland Mumford

KLA (United States)ORCID

4

Works

2

Citations

1

h-index

0

i10-index

Research Topics

Advanced Surface Polishing Techniques Laser Material Processing Techniques 3D IC and TSV technologies

Affiliations

Swansea University2023–2023

SPTS Technologies (United Kingdom)2023–2023

KLA (United States)2025–2025

Top Works

A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind

Roland Mumford,Janet Hopkins,et al.

20231 citations

Roland Mumford | Researchclopedia

Integrated Circuits and Semiconductor Failure Analysis

Thin-Film Transistor Technologies

Characterization of a UV-USP Laser Grooving Process Combined with Plasma Dicing to Support Next Generation Advanced Packaging Trends

Rogier Evertsen,Janet Hopkins,et al.

20241 citations

Development And Investigation Of A Novel Dry Etch Silicon Smoothing Process

20240 citations

Novel UV-USP Laser Grooving and Plasma Dicing Separation Schemes for Next Generation Advanced Packaging

Rogier Evertsen,Simon Dawson,et al.

20250 citations