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N. Klymko | Researchclopedia

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N. Klymko

IBM (United States)

45

Works

839

Citations

15

h-index

18

i10-index

Research Topics

Semiconductor materials and devices Copper Interconnects and Reliability Advancements in Semiconductor Devices and Circuit Design

Affiliations

Institut polytechnique de Grenoble2011–2011

IBM (United States)2001–2014

Commissariat à l'Énergie Atomique et aux Énergies Alternatives2011–2011

CEA Grenoble2011–2011

Samsung (United States)2013–2013

Top Works

Fabrication and mobility characteristics of ultra-thin strained Si directly on insulator (SSDOI) MOSFETs

K. Rim,K. Chan,et al.

2004156 citations

3D IC and TSV technologies

Metal and Thin Film Mechanics

A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

F. Liu,R. Yu,et al.

2008118 citations

High performance extremely thin SOI (ETSOI) hybrid CMOS with Si channel NFET and strained SiGe channel PFET

K. Cheng,A. Khakifirooz,et al.

201274 citations

Challenges of nickel silicidation in CMOS technologies

N. Breil,C. Lavoie,et al.

201452 citations

Oxygen induced adhesion degradation at metal/polyimide interface

Da‐Yuan Shih,N. Klymko,et al.

199149 citations

A study of the chemical and physical interaction between copper and polyimide

D‐Y. Shih,J. Paraszczak,et al.

198945 citations

Effect of rapid thermal annealing on strain in ultrathin strained silicon on insulator layers

T. S. Drake,Cáit Ní Chléirigh,et al.

200344 citations

Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress

Michael Belyansky,M. A. Chace,et al.

200833 citations

Fabrication of ultra-thin strained silicon on insulator

T. S. Drake,Cáit Ní Chléirigh,et al.

200332 citations