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Kun Ren | Researchclopedia
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Kun Ren
Hainan University
Top Works
Groundwater and Isotope Geochemistry
VLSI and Analog Circuit Testing
Study on removal mechanism and surface quality of SiCf/SiC composites by longitudinal torsional ultrasonic vibration-assisted grinding
Qixuan Sun
,
Kun Ren
,
et al.
2024
19 citations